Web links

Packaging Research Center – Georgia Institute of Technology

The CALCE EPSC located at the University of Maryland supports the world’s leading avionics, automotive, computer, semiconductor, and electronics manufacturers by providing information and services that match industry needs and an organizational structure in which different sectors of the electronics industry supply chain can share information and influence practices and policies

Packaging Lab – University of Texas-Austin.
Micro-Electronics R&D laboratory, High Density Interconnect facility

Packaging Lab – Cornell University
Advanced Electronics Packaging Facility

IME Singapore

The Institute of Microelectronics (IME) helps to drive the continual growth of Singapore’s electronics industries through excellent research and development. Formed in 1991 under the auspices of the Economic Development Board and the National University of Singapore, IME was corporatised on 1 April 1997. The Institute is funded by the Agency for Science Technology and Research.

The IPC is a United States-based trade association dedicated to furthering the competitive excellence and financial success of its members worldwide; who are participants in the electronic interconnect industry.
In pursuit of these objectives, the IPC will devote resources to management improvement and technology enhancement programs, the creation of relevant standards, protection of the environment, and pertinent government relations.

The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.

The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of the use of microelectronics and electronic packaging through professional and public education, the dissemination of information (by symposia, conferences, workshops, and other efforts) and the promotion of the Society’s portfolio of technologies. IMAPS currently has more than 7,000 members in the United States and more than 4,000 international members around the world.

IMEC, Belgium

IMEC (Interuniversity MicroElectronics Center) is Europe’s largest independent research center in the field of microelectronics, nanotechnology, enabling design methods and technologies for ICT systems. IMEC’s research runs 3 to 10 years ahead of industrial needs.

General Electric (GE) India

IBM Microelectronics is one of the industry’s foremost suppliers of interconnect products and services, enabling a full spectrum of applications through packaged semiconductors to fully tested electronic assemblies

ITRI is the leading American organization in providing international technology assessments and is becoming a key resource for the international development community.

The Semiconductor Industry Association (SIA) is the premier trade association representing the U.S. microchip industry. SIA member companies comprise 90 percent of U.S. semiconductor production and employ domestic workforce of more than 284,000. The SIA provides a forum for domestic semiconductor companies to work collectively to advance the competitiveness of the $102 billion U.S. chip industry.

The International Technology Roadmap for Semiconductors (ITRS) is an assessment of the semiconductor technology requirements. The objective of the ITRS s to ensure advancements in the performance of integrated circuits. This assessment, called roadmapping, is a cooperative effort of the global industry manufacturers and suppliers, government organizations, consortia, and universities.

Advanced Packaging – Online magazine

Chip Scale review – Online magazine

FlipChips.com – Online magazine