Academics: Coursework and Reading Material

E3-262 Electronic Systems Packaging

Credits 2:1 August-December term every year


  • G.V.Mahesh (24 hours)
  • Venkat Natarajan, Intel (2 hours)
  • Arun Chandrasekhar, Intel (8 hours)
  • K B Vasanta, CEDT (Lab Instructor)
    C Antonisamy, CEDT (Lab Instructor)


  • Electronic systems and needs.
  • Physical integration of circuits, packages, boards and full electronic systems.
  • System applications like computer, automobile, medical and consumer electronics with case studies.
  • Packaging levels; electrical design considerations- power distribution, signal integrity and parasitics; RF package design
  • Power delivery in systems; CAD for Printed Wiring Boards (PWBs);
  • Design for Manufacturability (DFM)
  • PWB Technologies, Single-chip (SCM) and Multi-chip modules (MCM), flex circuits; recent trends in manufacturing like microvias, sequential build-up circuits and high-density interconnect structures.
  • Materials in electronics packaging. Joining methods in electronics: lead-based and lead-free solders. Surface Mount technology- design, fabrication and assembly
  • Embedded Passives, SOC vs SIP vs SOP concepts.
  • Thermal management of PWBs, thermo-mechanical reliability, design for reliability and electrical test, Green packaging issues (lead-free soldering and assembly).
  • Hands-on lab sessions in design, fabrication of microvia boards and embedded passives; assembly of surface mount devices and ball-grid arrays; lead-free assembly.
  • Student seminars (two for the term; topics will be given by instructor in the class).

Suggested Reading and multimedia learning:

  • Rao R. Tummala, Fundamentals of Microsystems Packaging, McGraw Hill, NY, 2001.
  • William D. Brown, Advanced Electronic Packaging, IEEE Press, 1999.
  • Web-based Current literature.
  • Class notes
  • Multimedia learning on semiconductor processes and board fabrication/assembly processes.