ESD Design Essentials

Date: JANUARY 8-9, 2015


Instructors: Harald Gossner, Intel; Prof. Mayank Shrivastava, Indian Institute of Science

This two-day workshop consists of concentrated versions of twelve ESD tutorials which comprise the following topics:

  • ESD On-Chip Protection in Advanced Technologies
  • SPICE-Based ESD Protection Design Utilizing Diodes and Active MOSFET Rail Clamp Circuits
  • EOS/ESD Failure Models and Mechanisms
  • On-Chip ESD Protection in RF Technologies
  • Charged Device Model Phenomena and Design
  • Latch-up Physics and Design
  • Circuit Modeling and Simulation for On-Chip Protection
  • Troubleshooting On-Chip ESD Failures
  • Device Testing–IC Component Level: HBM, CDM, MM, and TLP
  • Impact of Technology Scaling on ESD High Current Phenomena and Implications for Robust ESD Design •Transmission Line Pulse Measurements: Parametric Analyzer for ESD On-Chip Protection
  • System Level ESD/EMI: Testing to IEC and other Standards


Why to learn ESD Device and Circuit Design?

Predominant failure mechanism: It is estimated that above ~25% of component failures are due to Electrical Overstress (EOS) and Electrostatic Discharge (ESD).

Changing Technologies: Constantly changing technologies make the ESD protection design challenging. Learning from past Si technologies is no more sufficient.

Reliable Chips: For reliable operation of Integrated circuits ESD continues to be a major concern.


Programe details:

DAY 1 JAN. 8

PART I (9:00 AM-1:00 PM) This part reviews the fundamentals of ESD testing, high-current physics, and ESD modeling. The focus is on device-level (HBM, CDM, MM, TLP) and system level testing, impact of technology scaling on ESD high current phenomena, as well as circuit modeling and simulation for on-chip protection.

PART II (2:00 PM-6:00 PM) The principles from part I are then applied to ESD Protection Design. This part describes ESD on-chip protection in advanced technologies, SPICE-based ESD protection design utilizing diodes, and active MOSFET rail clamp circuits.

DAY 2 JAN. 9

PART III (9:00 AM-1:00 PM) This part describes special ESD design cases, including Charged Device Model (CDM) phenomena and design, on-chip ESD protection in RF Technologies, and latch-up physics and design.

PART IV (2:00 PM-6:00 PM) The final section discusses EOS/ESD failure models and mechanisms. The seminar concludes with practical examples for troubleshooting of on-chip ESD failures.

This event is Co-Sponsored by the IEEE Local Chapter of Bangalore