TITLE:

Impact of Technology Scaling on Components High Current Phenomena and Implications for Robust ESD Design.

ABSTRACT:

This tutorial will focus on high-current behavior of stand-alone components, with the aim of optimizing effectiveness of ESD clamp devices (irrespectively of their schematic implementation) and maximizing the ESD SOA (Safe Operating Area). Components in both Analog and Digital technologies will be discussed, with emphasis on technology trends.

Biography:

Gianluca Boselli completed his master in EE at the University of Parma (Italy, 1996) and his PhD at the University of Twente (The Netherlands, 2001), where he worked on high current phenomena in CMOS technologies. In 2001, he joined Texas Instruments, Inc., Dallas, Texas, where he focused on ESD and latch-up development for advanced CMOS technologies, with particular emphasis on process and modeling aspects. In 2009 he was promoted corporate ESD Design and Development Manager to support the entire Texas Instruments portfolio. Since 2014, his responsibilities extended into compact modeling, where he is now compact modeling corporate manager, with responsibility to deliver compact models and simulation infrastructures to Texas Instruments design community.

He authored several papers in the area of ESD and latch-up. He presented his work at major conferences, including EOS/ESD Symposium, IEDM, and IRPS. He has also presented many invited tutorials and papers at various conferences, including EOS/ESD Symposium, IRPS, IEDM, ESREF, IEW, and RCJ.

Dr. Boselli has been the recipient of the best paper award on behalf of Microelectronics Reliability Journal in 2000. He received the best paper award at the EOS/ESD Symposium 2002. He also received the Outstanding Symposium award at the EOS/ESD Symposium in 2002, 2006, and 2010.

Dr. Boselli served multiple times as sub-committee chair for technical program committees (TPC) of EOS/ESD Symposium, IEDM, IRPS, IEW, and ESREF. He served as moderator and panelist in many workshops in ESD and latch-up area.

Dr. Boselli has served as TPC chair at the EOS/ESD Symposium 2006, vice-general chair at the EOS/ESD Symposium 2007, and general chair at the EOS/ESD Symposium 2008.
He is currently a member of the board of directors of EOS/ESD Association, Inc.; where he is the President Emeritus. He is the recipient to ESDA Outstanding Contribution Award.

Dr. Boselli is an IEEE senior member and holds over thirty patents with several pending.
Dr. Boselli serves in the editorial board of the IEEE Transactions on Device and Materials Reliability (T-DMR).